Henkel’s Low Pressure Molding (LPM) technology provides a fast, reliable, and sustainable solution for encapsulating electronic components using specialized polyamide hot melt materials. This method, similar to plastic injection molding but at lower pressures, ensures electrical insulation, waterproofing, chemical resistance, and impact protection while reducing production time to as little as 30 seconds—a significant improvement over traditional potting, which takes up to 24 hours.
Key Advantages:
- Faster production with minimal steps
- Lightweight, compact designs using the “skyline” encapsulation approach
- Versatile applications across industries, including medical devices, e-bikes, LED lighting, and power electronics
- Sustainable materials (60%-80% bio-based, solvent-free, RoHS & REACH compliant)
- Long shelf-life (over 2 years)
Future Innovations:
Henkel continues to develop next-gen TECHNOMELT® formulations with improved thermal conductivity, hydrolysis resistance, flammability resistance, and electrical conductivity.
Notable TECHNOMELT® PA Products for Electronics & PCBA:
- Amber: PA 633, PA 652, PA 6208 N, PA 673, PA 682
- Black: PA 638, PA 657, PA 6208 N BLACK, PA 678, PA 687
With over 30 years of success, Henkel’s LPM technology remains a leading solution for durable, high-performance electronics protection.
