DOWSIL™ Thermally Conductive Encapsulants: Advanced Protection & Heat Management
Proven Performance in Extreme Conditions
DOWSIL™ thermally conductive encapsulants are high-performance silicone-based materials designed to provide superior protection and efficient heat dissipation in critical electronic applications. With decades of field-proven reliability, these solutions withstand shock, oxidation, and moisture, while maintaining mechanical and chemical stability across temperatures from -40ºC to 200ºC.
Key Benefits
✅ Low Viscosity – Ensures easy flow and deep penetration for uniform coverage.
✅ Heat Dissipation & Protection – Enhances thermal performance while safeguarding delicate components.
✅ Low Modulus – Minimizes stress and mechanical strain on sensitive parts.
✅ Primerless Options Available – Simplifies processing and enhances adhesion.
Applications
✔ Automotive
✔ Solar
✔ Power Electronics
✔ Industrial Equipment
✔ Aviation
✔ Inverters
✔ Optical Communication Boards (OCB)
✔ Electronic Control Units (ECU)
✔ Lighting Modules & Displays
Product Overview & Performance
DOWSIL™ offers a range of encapsulants tailored to different performance needs, including:
- DOWSIL™ TC-6011 – Balanced thermal conductivity and mechanical strength.
- DOWSIL™ TC-6015 – Enhanced flowability for automated applications.
- DOWSIL™ TC-6020 – Optimized for high-volume production.
- DOWSIL™ TC-6032 – High thermal conductivity with excellent protection.
- DOWSIL™ TC-6040 – Best-in-class thermal performance.
Each formulation offers a unique balance of pot life, flowability, thermal conductivity, hardness, and density, ensuring the right fit for your application.
