✍At Avantek: the customer was referred Material Solutions for Camera Module & Sensor Assembly
🎯 The camera module industry is sharper than ever and it’s evolving fast. From smartphones to automotive systems, demand for high-performance imaging is driving innovation in miniaturization, multi-lens setups, and sensor functionality.
✨ At Avantek, we partner with Henkel, the global leader in electronic materials, to deliver cutting-edge adhesive and encapsulation solutions for compact camera module assembly.
💡Why it matters: As camera modules become more complex with interdependent components like die, lenses, filters, and FPCs reliable bonding, precise alignment, and thermal/electrical management are key to consistent performance.
✨ Complete solutions include:
✅ Die attach adhesives – minimizing warpage for high-precision sensors
✅ UV + Thermal dual-cure adhesives – enabling accurate active alignment
✅ Electrically conductive adhesives (ECAs) – for robust interconnects
✅ Lens and housing bonding – securing optical elements reliably
✅ Underfills and FPC reinforcement – boosting structural integrity and lifespan
With Avantek’s local support and Henkel’s decades of experience, manufacturers gain a trusted materials partner to meet the challenges of next-gen camera modules.
