Bergquist Gap Filler TGF 7000 for Automotive and Power Electronics
Henkel has introduced Bergquist Gap Filler TGF 7000, a high-performance liquid thermal interface material (TIM) designed to enhance heat dissipation in ADAS, power conversion systems, electric pumps, and electronic control units (ECUs).
Key Features & Benefits
🔹 High Thermal Conductivity – 7.0 W/mK for efficient heat transfer
🔹 Fast Dispensing – 18 grams per second, improving manufacturing efficiency
🔹 Silicone-Based, Two-Part Liquid TIM – Cures at room temperature, remaining soft to minimize stress on components
🔹 Controlled Volatility – Siloxane content below 300 ppm, ensuring compatibility with bonding surfaces & optical components
🔹 Prevents Equipment Issues – No separation, settling, caking, or clogging, ensuring smooth dispensing
“For next-generation automotive designs, smaller and high-power components require advanced thermal management solutions,” says Holger Schuh, Henkel Global Technology Expert. “Our new Gap Filler ensures optimal heat dissipation while maintaining compatibility and process efficiency.”
With superior thermal performance, easy processing, and reliability, Bergquist Gap Filler TGF 7000 is set to drive innovation in automotive and power electronics. 🚗⚡
