Avantek’s Advanced Encapsulants, Coatings & Potting Solutions

✍Shield Your Electronics: Avantek’s Advanced Encapsulants, Coatings & Potting Solutions

✨Avantek Vietnam delivers end‑to‑end polymer protection solutions—ranging from precision die encapsulants and dam‑and‑fill systems to thin‑film conformal coatings and robust potting compounds across leading chemistries (acrylic, polyurethane, epoxy, silicone) and cure methods (room‑temperature, heat, UV, UV dual‑cure). To safeguard semiconductor packages and PCB assemblies against mechanical stress, moisture, chemicals, and contaminants, thereby significantly extending service life and reliability for high‑value electronics.

🎯Avantek’s Electronic Protection Systems
🔹Die Coat / Die Encapsulant: Ultra‑low viscosity silicones and epoxies for void‑free, under‑fill protection of wire‑bonded chips and flip‑chip assemblies.
🔹Dam & Fill: Epoxy or silicone dams followed by precision fill to encapsulate sensors, MEMS, and discrete components on hybrid substrates.
🔹Conformal Coating: 1–3 mil thin films applied by spray, dip, or selective dispense; options include acrylic, silicone, and urethane chemistries.
🔹Potting: Thick‑section encapsulation in molds or housings using room‑temperature or heat‑cure epoxies, silicone gels, and fire‑retardant, halogen‑free systems or complete environmental and mechanical protection

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✍At Avantek: the customer was referred Material Solutions for Camera Module & Sensor Assembly 🎯 The camera module industry is sharper than ever and it’s evolving fast. From smartphones to automotive systems, demand for high-performance imaging

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