Thermal Management

Avantek Vietnam offers a comprehensive range of advanced thermal management solutions, providing critical materials designed to enhance the efficiency and performance of electronic components. Our extensive portfolio includes thermal gap fillers, which are thermally conductive liquid materials that efficiently fill air gaps for superior thermal transfer. We also provide thermal gap pads, designed to enhance conductivity by filling air spaces between electronic components and heat sinks. For cleaner and more efficient thermal interfaces, we offer Sil Pads, which serve as electrically and non-electrically insulating materials. Additionally, our thermally conductive adhesives deliver high structural bond strength, even in extreme environments, while our phase change materials provide a cost-effective and efficient alternative to traditional thermal greases. We also offer thermally conductive grease, which ensures excellent thermal transfer and minimal bondline thickness. Lastly, our thermal gels offer highly conformable gap-filling capability to further enhance thermal conductivity. Each of these products is crafted to meet unique and demanding thermal management requirements, offering both reliability and performance for modern electronics.