Henkel Loctite Eccobond UF 9000AE for AI & HPC Advanced Packaging
Henkel has introduced Loctite Eccobond UF 9000AE, a capillary underfill encapsulant designed to protect large, high I/O die in flip-chip BGA (FCBGA), high-density fan-out (HD-FO), and 2.5-D advanced packaging devices. This innovation enhances bump protection, warpage control, and encapsulation efficiency, meeting the high-performance needs of AI and HPC applications.
Key Features & Benefits:
- Designed for large die and complex architectures (e.g., >40 mm x 40 mm die, >100 mm x 100 mm packages)
- Fast, void-free encapsulation for fine-pitch (~100 µm), low gap height (~50 µm) interconnects
- Enhanced bump protection and warpage control to improve electrical, thermal, and moisture reliability
- Low resin bleed out (RBO) and narrow fillets, ensuring dense die integration
- 20% faster flow than previous Henkel underfills, ensuring complete interconnect encapsulation
- Successfully tested on die up to 50 mm x 50 mm and packages up to 110 mm x 110 mm
Industry Impact:
Ramachandran Trichur, Henkel’s Global Market Segment Head for Semiconductor Packaging Materials, emphasized that Loctite Eccobond UF 9000AE balances strong bump protection with high process efficiency, making it ideal for next-gen AI, HPC, and 2.5-D/3-D advanced packaging. This innovation supports Moore’s Law scaling alternatives and helps drive the next wave of semiconductor technology.
Henkel continues to push semiconductor packaging boundaries, ensuring higher reliability, better yield, and advanced performance for cutting-edge AI and computing applications.
