The FX219G5 Silicone Potting Compound from Everwide is a high-performance, two-component addition-cure silicone material designed for comprehensive potting and encapsulation of electronic assemblies. It delivers excellent electrical insulation, environmental protection, and thermal performance, while remaining durable and flexible after curing — ideal for power electronics, LED drivers, automotive sensors, and industrial control systems.
Key Features
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Two-component (A:B = 1:1) silicone with excellent flow and gap-filling ability
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High thermal conductivity: ~2.0 W/m·K, for improved heat dissipation
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Low shrinkage & gas-free cure — protects sensitive components
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Wide operating temperature range: –65°C to 200°C
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UL 94 V-0 (3 mm) flammability rating, RoHS compliant
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Strong electrical insulation and environmental resistance
Typical Uses: Potting LED drivers, power supplies, automotive modules, PCBs, sensors, industrial electronics
Product Comparison: Everwide FX219G5 vs. Shin-Etsu KET-132 A/B
| Feature | Everwide FX219G5 | ShinEtsu KET‑132 A/B |
|---|---|---|
| Material Type | Two-component addition-cure silicone | Two-component addition-cure silicone potting compound |
| Primary Use | Electronic potting & encapsulation | Electronic potting & protection |
| Thermal Conductivity | ~2.0 W/m·K (enhanced thermal transfer) | ~0.30 W/m·K – typical insulation focus |
| Operating Temperature | –65°C to 200°C | –40°C to 200°C (up to 260°C intermittent) |
| Electrical Insulation | High | High (Volume resistivity ~2 TΩ·m) |
| Dielectric Strength | Excellent | ~27 kV/mm |
| Cure Profile | Addition cure; heat or room temperature (varies by grade) | A:B mix, ~8 hr working time / 15 min @100 °C cure |
| Flammability | UL 94 V-0 (3 mm) | UL94 V-0 rated in many applications |
| Typical Strength/Hardness | Flexible yet robust | Moderate hardness & tensile strength (~3.5 MPa) |
