DOWSIL™ TC-6015 Thermally Conductive Encapsulant

Applications

DOWSIL™ TC-6015 is primarily designed for advanced electronic and power applications. Its use cases include:

• PV Inverters & Renewable Energy Systems
• Energy Storage Systems
• Automotive Control Units/EV Modules
• High-Power Modules

Key Specifications & Advantages

Specifications (as provided in the technical data sheet):

• Thermal Conductivity: 1.6 W/m·K, ensuring effective heat transfer away from critical components.
• Viscosity & Pot Life: With a pot life of about 90 minutes at 25°C, it offers enough working time for processing. The viscosity values (around 4000 mPa·s when mixed) ensure good flowability with minimal filler settling.
• Curing Options: It cures at room temperature with an option for accelerated heat cure (e.g., 30 minutes at 70°C), offering flexibility in manufacturing.
• Mechanical Properties: Durometer (40 Shore A), tensile strength (0.7 MPa) and elongation (30%) indicate a robust yet flexible material suited to various assembly requirements.
• Flame Retardancy: UL 94 V-0 rating confirms its safety in environments where fire resistance is crucial.

Market Trends

The market for thermally conductive encapsulants is growing, driven by several factors:

• Increased Demand in Electronics: As devices become smaller and more powerful, efficient thermal management is essential. Manufacturers are increasingly looking for materials that can reliably manage heat in compact assemblies.
• Automotive Electrification: The shift toward electric vehicles (EVs) and advanced driver-assistance systems (ADAS) has heightened the need for robust encapsulants that can withstand high temperatures and offer flame retardancy.
• Renewable Energy Systems: Inverters and power converters used in solar and wind energy require materials that can efficiently dissipate heat while maintaining electrical insulation.
• Advances in Material Science: Continuous improvements in silicone chemistry, including properties such as flowability and adhesion, support the development of products that meet the evolving reliability standards in high-tech applications.

Overall, DOWSIL™ TC-6015 Thermally Conductive Encapsulant represents a robust solution for modern electronic assemblies, combining excellent thermal performance with versatile processing options—attributes that align well with current market demands in the electronics, automotive, and renewable energy sectors.

👉​For more information, please reach out to us on our Linkedin page: https://www.linkedin.com/company/mro-direct-materials
————————–
AVANTEK VIET NAM
💕 Trust MRO, direct materials and equipment solutions
🌐 https://avantek.vn
📧 info@avantek.vn
☎ (+84) 944 415 762 & (+84) 889 901 929