Low Pressure Molding in Automotive: LPMS & TECHNOMELT

Low Pressure Molding in Automotive

Application & Benefits:

  • Component Protection:
    TECHNOMELT hotmelt adhesives are ideal for encapsulating and protecting sensitive automotive electronic components such as PCBs, sensors, and connectors from environmental stresses (moisture, vibration, chemicals, and temperature extremes).

  • Process Advantages:

    • Low Injection Pressure:
      Minimizes damage to delicate components during encapsulation.
    • Fast Cycle Times:
      Streamlined processing enables rapid production and reduced cycle times.
    • Simplified Process:
      Eliminates the need for complex mixing or curing steps common in traditional potting methods.
    • Sustainability:
      Many formulations include high levels of bio-based and recyclable materials, supporting green manufacturing.

Automotive Applications:

  • Underhood Electronics:
    Protecting control units and sensors that operate in harsh, high-temperature environments.
  • Connector Sealing & Cable Strain Relief:
    Overmolding techniques secure connections and provide strain relief, ensuring durability and resistance to environmental factors.
  • LED & Lighting Components:
    Encapsulation of sensitive light modules, preserving performance while protecting against impact and vibration.

Product Items & Solutions

Some key items include:

  • TECHNOMELT PA 673 (Amber):
    Known for its excellent high-temperature performance, ideal for under-hood applications.
  • Other TECHNOMELT Variants (e.g., PA 652, PA 6208, PA 678):
    Each is designed with specific attributes, such as improved adhesion, solvent resistance, or enhanced flexibility at low temperatures.

Process Flow:

  1. Insertion:
    Automotive components (e.g., PCBs, sensors) are placed in a pre-designed mold set.
  2. Molding:
    The hotmelt adhesive is injected at low pressure, encapsulating the component without damaging it.
  3. Testing & Assembly:
    After a fast cycle, the molded parts are tested and moved to final assembly—enhancing both production speed and quality.

Conclusion

LPMS’s low pressure molding solutions, using TECHNOMELT hotmelt adhesives, offer automotive manufacturers an efficient, sustainable, and cost-effective method to protect electronic components. These solutions ensure high performance under extreme conditions, meeting the rigorous demands of the automotive industry.

Let me know if you need further details or have any additional questions & contact to Avantek- Tel: +84889901929. Mail: info@avantek.vn

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