The DOWSIL TC-5960 is a thermally conductive compound formulated with thermally conductive fillers in a matrix of silicone, designed to offer high thermal conductivity and strong pump-out resistance.
Key Features
- High thermal conductivity For efficient cooling.
- Resistance to pump-out, ideal for bare mold applications.
- Thixotropic material with high temperature stability.
- One-component formulation that does not require polymerization.
- Solvent-free, ensuring stability after the container is opened.
- Easy application, compatible with screen printing, stencil printing and dispensing.
- Low thermal resistance and thin Bond Line Thickness (BLT) To maximize heat transfer.
DOWSIL TC-5960: composition and applications
The DOWSIL TC-5960 is composed of thermally conductive charges dispersed in a siloxane polymer matrix., making it suitable for use in PCB systems, heat sinks and chassis.
Due to its properties, it is used for the cooling of electronic modules, particularly in consumer devices, where increasing miniaturization makes thermal management increasingly complex.
Applications
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Electronic Module Cooling:
Used to cool PCB assemblies, ensuring optimal operating temperatures and improved reliability. -
Heat Sink Interface:
Acts as a thermal “bridge” between electronic devices and heat sinks or chassis, maximizing heat dissipation. -
Bare Die Applications:
Provides strong pump‑out resistance for direct application on bare semiconductor dies. -
Consumer Electronics:
Ideal for applications in compact, high‑density electronic devices where efficient thermal management is critical.
