✍Background / Market TrendAs Avantek Vietnam, we know the automotive industry pushes the boundaries of performance, durability, and efficiency, traditional sealing methods are no longer enough. Manufacturers face mounting challenges from higher operating temperatures and

🎇ANNOUNCEMENT OF LIBERATION DAY (30th APRIL) AND INTERNATIONAL LABOR DAY (1st MAY) HOLIDAYS 2025🎇 ✍Dear valued Shareholders, Partners and Customers, please be informed that our offices will be closed during the Liberation Day (30th April)

✍What Is Underfill Underfill is an epoxy composition applied between a flip‑chip or package and the printed circuit board (PCB) to mechanically reinforce solder joints and protect against thermal‑mechanical fatigue. By penetrating the gap via

✍Shield Your Electronics: Avantek’s Advanced Encapsulants, Coatings & Potting Solutions ✨Avantek Vietnam delivers end‑to‑end polymer protection solutions—ranging from precision die encapsulants and dam‑and‑fill systems to thin‑film conformal coatings and robust potting compounds across leading chemistries

✍Driving the Future of Automotive Electronics – How Henkel’s Advanced Materials and ADAS RADARS Applications 🎯 Henkel continues to lead innovation in automotive electronics with a comprehensive portfolio of advanced materials that enhance both performance

✍At Avantek: the customer was referred Material Solutions for Camera Module & Sensor Assembly 🎯 The camera module industry is sharper than ever and it’s evolving fast. From smartphones to automotive systems, demand for high-performance imaging